New HiPE White Paper Published

New HiPE White Paper Published

New HiPE White Paper Published: Review of Technologies for Power Electronics The HiPE project has released its new White Paper, “Gate driver and power module integration – Part A – Review of Technologies for Power Electronics.” The document provides a concise overview...
Evaluating Next-Gen Power Packaging

Evaluating Next-Gen Power Packaging

Evaluating Next-Gen Power Packaging: How Top-Side Cooling Performs Effective thermal management is essential for improving the performance and reliability of power electronics. A recent article in Power Systems Design, co-authored by Sebastian Klötzer, Ilian B from...