Final Newsletter | April 2026

Final Newsletter | April 2026

As the HiPE project comes to an end, we would like to take a moment to reflect on our shared journey over the past three years. What began as an ambitious initiative to develop a new family of highly energy-efficient, cost-effective, modular, compact and integrated...
Final Newsletter | April 2026

Final Results of the HiPE Project

From Research to Application: Final Results of the HiPE Project Date: 28. April 2026 Time: 09:30 – 12:00 (CEST) Mode: Online (via MS Teams) Description: Join us for the final online event of the EU-funded HiPE (Highly Integrated Power Electronics) project, where...
New HiPE White Paper Published

New HiPE White Paper Published

New HiPE White Paper Published: Review of Technologies for Power Electronics The HiPE project has released its new White Paper, “Gate driver and power module integration – Part A – Review of Technologies for Power Electronics.” The document provides a concise overview...
Evaluating Next-Gen Power Packaging

Evaluating Next-Gen Power Packaging

Evaluating Next-Gen Power Packaging: How Top-Side Cooling Performs Effective thermal management is essential for improving the performance and reliability of power electronics. A recent article in Power Systems Design, co-authored by Sebastian Klötzer, Ilian B from...