New HiPE White Paper Published: Review of Technologies for Power Electronics
The HiPE project has released its new White Paper, “Gate driver and power module integration – Part A – Review of Technologies for Power Electronics.”
The document provides a concise overview of essential technologies used in modern power electronics, covering semiconductor devices, gate driver fundamentals, and packaging approaches.
Authored by partners from I&M, Nexperia, and Marelli, the White Paper reflects the collective expertise gained throughout the HiPE project and supports broader dissemination of its technical insights.